Laser soldering is often applied as selective laser soldering. Parts, which can`t be soldered by wave or reflow soldering, are soldered subsequently by lasers. This can be parts, which are heat sensitive or need a special temperature programm due to their part size.

The diagram below shows a process, which can be defined by a simple programming language and stored in the LASCON® program.

The green curve in the diagram shows the progress of the setpoint temperature. The red curve represents the real, controlled temperature in the laser’s focus (actual temperature). The black curve denotes to the controller output signal for the diode laser with analog voltage. The black curve corresponds with the 0-100% of the axis scale on the right side of the diagam.

Initially, the pad is heated up to a temperature of 300°C.
After approximately 1 second, LASCON® switches on the solder wire feeder. The solder wire feeder is switched off after approx 1.4 s. The process can be monitored on-line, allowing Pass / Fail decisions to be made.

As an alternative to welding with tin solder wire, laser soldering with soldering paste is also possible. The paste must be applied with a dispenser. Squirting is largely prevented due to an optimized temperature program.

• Local heat absorption
• Exact temperature control
• On-line quality control
• Larger quantities of heat can be emitted to small spots
• Various points can be warmed up simultaneously or in succession using scanners

Press release :

New press release ( sorry - only in german ! ) for selective laser soldering in Productronic Magazine February 2011:

Zielgenau Laserlöten - PDF 193 kB